It comes with a complete set of wafer handing system with edge grip and place a wafer on the inspection stage automatically.

Optional automated defect inspection software enables wafer sorting by automated inspection results of defects. Inspection categories are, dimple, mound, saw mark, non-uniform polishing marks, orange peel, SORI and others.



Wafer size 4 inch to 12 inch wafers
Defects type Flatness, dimples, saw marks, Orange peel, etc.
Magnification 1X to 3X
Sensitivity Seamless sensitivity adjustment setting
Light source 550nm (Stabilized light source)
Camera High resolution CCD camera
Inspection stage Manual stage (standard)


Output of inspection results will be: Type of defect, number of defects per category and their respective positions by dialogs.