It comes with a complete set of wafer handing system with edge grip and place a wafer on the inspection stage automatically.
Optional automated defect inspection software enables wafer sorting by automated inspection results of defects. Inspection categories are, dimple, mound, saw mark, non-uniform polishing marks, orange peel, SORI and others.
|Wafer size||4 inch to 12 inch wafers|
|Defects type||Flatness, dimples, saw marks, Orange peel, etc.|
|Magnification||1X to 3X|
|Sensitivity||Seamless sensitivity adjustment setting|
|Light source||550nm (Stabilized light source)|
|Camera||High resolution CCD camera|
|Inspection stage||Manual stage (standard)|
Output of inspection results will be: Type of defect, number of defects per category and their respective positions by dialogs.