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It comes with a complete set of wafer handing system with edge grip and place a wafer on the inspection stage automatically. Optional automated defect inspection software enables wafer sorting by automated inspection results of defects. Inspection categories are, dimple, mound, saw mark, non-uniform polishing marks, orange peel, SORI and others. |
■Specification
| Wafer size | 4 inch to 12 inch wafers |
| Defects type | Flatness, dimples, saw marks, Orange peel, etc. |
| Magnification | 1X to 3X |
| Sensitivity | Seamless sensitivity adjustment setting |
| Light source | 550nm (Stabilized light source) |
| Camera | High resolution CCD camera |
| Inspection stage | Manual stage (standard) |
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Output of inspection results will be: Type of defect, number of defects per category and their respective positions by dialogs. |
